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We are pleased to announce that El-Cat is a sponsor of the upcoming 20th Gadest Conference in Bad Schandau, Germany, September 8 to 13, 2024.. As a supporter of innovation and collaboration in the industry, El-Cat is excited to contribute to the success of this event. Our commitment to fostering advancements aligns perfectly with the goals of the Gadest Conference, and we look forward to engaging with like-minded professionals, sharing insights, and building lasting connections at this prestigious gathering.

Useful links:

• https://blogs.hrz.tu-freiberg.de/gadest2024/
• https://de.linkedin.com/in/gadest-conference-in-bad-schandau-041b94282
• https://blogs.hrz.tu-freiberg.de/gadest2024/sponsors/

Let's meet in Bad Schandau (Germany), September 8 to 13, 2024.

X-ray diffraction is a popular method of analysis for determining the structural properties of crystalline substances. Samples for the analysis are loaded using sample holders. The perfect holder should not show any diffraction that disturbs the measurement results. El-Cat has developed Zero diffraction XRD holders and has now verified the high quality of the product with Delft University of Technology. Please let us know if you are interested in obtaining such holders. They are available in various sizes, with or without pockets.

Semiconductor tweezers are specially designed to handle different fragile and delicate materials such as semiconductor wafers, glass and ceramic wafers. These wafer handling tweezers come in different variants to suit your needs. Please contact us to order tweezers that we currently have in stock.

Please check out our new brochure designed for our valued customers. Inside you will find information about El-Cat Inc., El-Cat Europe, our services and all of the amazing materials that we can provide. You can also find contact details, information on ordering, payments and shipping.

Please make sure to check out our new brochure designed for our valued customers. Inside the brochure you can find all the information about both El-Cat Inc. and El-Cat Europe as well as our services. You can also find contact details, information on ordering, payments and shipping.

Numerically controlled laser cutting, drilling and engraving of silicon wafers and other materials into squares and arbitrarily intricate shapes is now available as a service.

Laser	Work Area	Materials Processed	Materials NOT Processed
20 W IR Laser at 1,060 nm	175 × 350 mm	Silicon GaAs InP SiC Alumina Soda-Lime glass Al, Cu, Fe and other metals	Quartz Fused Silica Sapphire Pyrex/Borofloat Glass InSb
23 W UV Laser at 355 nm	175 × 175 mm

We can now coarse and find wafers 3", 4" and 6" diameter to a precision of ± 1 µm. Grinding wafers as thin as 100 µm is now possible. We also made thickness standards, 25 wafers from 100 µm to 580 µm in steps of 20 µm. We can also use the grinder with our warp reduction techniques to produce 6" wafers with Warp <5µm.