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Please make sure to check out our new brochure designed for our valued customers. Inside the brochure you can find all the information about both El-Cat Inc. and El-Cat Europe as well as our services. You can also find contact details, information on ordering, payments and shipping.

Numerically controlled laser cutting, drilling and engraving of silicon wafers and other materials into squares and arbitrarily intricate shapes is now available as a service.

Laser	Work Area	Materials Processed	Materials NOT Processed
20 W IR Laser at 1,060 nm	175 × 350 mm	Silicon GaAs InP SiC Alumina Soda-Lime glass Al, Cu, Fe and other metals	Quartz Fused Silica Sapphire Pyrex/Borofloat Glass InSb
23 W UV Laser at 355 nm	175 × 175 mm

We can now coarse and find wafers 3", 4" and 6" diameter to a precision of ± 1 µm. Grinding wafers as thin as 100 µm is now possible. We also made thickness standards, 25 wafers from 100 µm to 580 µm in steps of 20 µm. We can also use the grinder with our warp reduction techniques to produce 6" wafers with Warp <5µm.