El-Cat Brochure Now Available
Please make sure to check out our new brochure designed for our valued customers. Inside the brochure you can find all the information about both El-Cat Inc. and El-Cat Europe as well as our services. You can also find contact details, information on ordering, payments and shipping.
Introducing Laser Cuttings and Engravings
Numerically controlled laser cutting, drilling and engraving of silicon wafers and other materials into squares and arbitrarily intricate shapes is now available as a service.

Laser Work Area Materials Processed Materials NOT Processed
20 W IR Laser at 1,060 nm 175 × 350 mm
  • Silicon
  • GaAs
  • InP
  • SiC
  • Alumina
  • Soda-Lime glass
  • Al, Cu, Fe and other metals
  • Quartz
  • Fused Silica
  • Sapphire
  • Pyrex/Borofloat Glass
  • InSb
23 W UV Laser at 355 nm 175 × 175 mm
laser holes on SiO2 laser QR code 3 TEST laser cut 1 TEST laser cut 2 Recessed wafer 1 Recessed wafer 3 Silicon frames 1 Silicon frames 2
Cuttings and Engravings Gallery
We have a new Grinder!
We can now coarse and find wafers 3", 4" and 6" diameter to a precision of ± 1 µm. Grinding wafers as thin as 100 µm is now possible. We also made thickness standards, 25 wafers from 100 µm to 580 µm in steps of 20 µm. We can also use the grinder with our warp reduction techniques to produce 6" wafers with Warp <5µm.
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